x2y surface mount emi flters - x2y integrated passive components type e03 chip size 0603 0805 1206 1410 1812 2220 rated voltage dielectric minimum and maximum capacitance values 16vdc c0g/np0 150pf - - - - - x7r 15nf - - - - - 25vdc c0g/np0 120pf 560pf-820pf 1.8nf-3.3nf 6.8nf-8.2nf 12nf-15nf 22nf-33nf x7r 12nf 56nf-68nf - 470nf 820nf 1.2f 50vdc c0g/np0 10pf-100pf 390pf-470pf 1.2nf-1.5nf 4.7nf-5.6nf 8.2nf-10nf 18nf x7r 150pf-10nf 18nf-47nf 56nf-220nf 180nf-400nf 390nf-680nf 560nf-1.0f 100vdc c0g/np0 - 10pf-330pf 22pf-1.0nf 100pf-3.9nf 820pf-6.8nf 1.0nf-15nf x7r - 470pf-15nf 1.5nf-47nf 4.7nf-150nf 8.2nf-330nf 10nf-470nf note: for some lower capacitance parts, higher voltage rated parts may be supplied. w t b2 l b1 0603 0805 1206 1410 1812 2220 l 1.60.2 (0.0630.008) 2.00.3 (0.080.012) 3.20.3 (0.1260.012) 3.60.3 (0.140.012) 4.50.35 (0.180.014) 5.70.4 (0.220.016) w 0.80.2 (0.030.008) 1.250.2 (0.050.008) 1.600.2 (0.0630.008) 2.50.3 (0.10.012) 3.20.3 (0.1260.012) 5.00.4 (0.20.016) t 0.50.15 (0.020.006) 1.00.15 (0.040.006) 1.10.2 (0.0430.008) 2 max. (0.08 max.) 2 max. (0.08 max.) 2.5 max. (0.1 max.) b1 0.40.15 (0.0160.006) 0.50.25 (0.020.01) 0.950.3 (0.0370.012) 1.200.3 (0.0470.012) 1.40.35 (0.060.014) 2.250.4 (0.090.016) b2 0.250.15 (0.0100.006) 0.30.15 (0.0120.006) 0.50.25 (0.020.01) 0.50.25 (0.020.01) 0.750.25 (0.030.01) 0.750.25 (0.030.01) recommended solder lands 0603 0805 1206 1410 1812 2220 a 0.6 (0.024) 0.95 (0.037) 1.2 (0.047) 2.05 (0.08) 2.65 (0.104) 4.15 (0.163) b 0.6 (0.024) 0.9 (0.035) 0.9 (0.035) 1.0 (0.04) 1.4 (0.055) 1.4 (0.055) c 0.4 (0.016) 0.3 (0.012) 0.6 (0.024) 0.7 (0.028) 0.8 (0.03) 1.2 (0.047) d 0.2 (0.008) 0.4 (0.016) 0.8 (0.03) 0.9 (0.035) 1.4 (0.055) 1.8 (0.071) the syfer x2y integrated passive component is a 3 terminal emi chip device. when used in balanced line applications, the revolutionary design provides simultaneous line-to-line and line-to- ground fltering, using a single ceramic chip. in this way, differential and common mode fltering are provided in one device. for unbalanced applications, it provides ultra low esl (equivalent series inductance). capable of replacing 2 or more conventional devices, it is ideal for balanced and unbalanced lines, twisted pairs and dc motors, in automotive, audio, sensor and other applications. available in sizes from 0603 to 2220, these flters can prove invaluable in meeting stringent emc demands. manufactured in the uk by syfer technology limited under licence from x2y attenuators llc. dielectric x7r or c0g/np0 electrical confguration multiple capacitance capacitance measurement at 1000hr point typical capacitance matching better than 5% temperature rating -55c to 125c dielectric withstand voltage 2.5 x rated volts for 5 secs. charging current limited to 50ma max. insulation resistance 100gohms or 1000s (whichever is the less) advantages replaces 2 or 3 capacitors with one device ultra low inductance due to cancellation effect for balanced lines: matched capacitance line to ground on both lines differential and common mode attenuation effects of temperature and voltage variation eliminated effect of ageing equal on both lines high current capability applications single ended/unbalanced lines balanced lines and twisted pairs emi suppression on dc motors sensor/transducer applications wireless communications audio amplifers canbus systems c b a d note 1: all dimensions mm (inches). note 2: pad widths less than chip width gives improved mechanical performance. note 3: insulating the earth track underneath the flters is acceptable and can help avoid displacement of flter during soldering. fltsmx2y.ver7
ordering information 1812 y 100 0334 m x t e03 chip size termination voltage capacitance in picofarads (pf) c 1 tolerance dielectric packaging type 0603 0805 1206 1410 1812 2220 j = nickel barrier y = flexicap? a = (tin/lead) h = flexicap? (tin/lead) 16 = 16vdc 25 = 25vdc 50 = 50vdc 100 = 100vdc first digit is 0. second and third digits are signifcant fgures of capacitance code. the fourth digit is number of zeros following example: 0334=330nf. note: c 1 = 2c 2 m = 20% c = c0g/ np0 x = x7r t=178mm (7) reel r=330mm (13) reel b = bulk syfer x2y integrated passive component 178mm (7) reel 0603 0805 1206 1410 1812 2220 4000 3000 2500 2000 1000 1000 330mm (13) reel 0603 0805 1206 1410 1812 2220 16000 12000 10000 8000 4000 4000 reeled quantities the internal structure furnishes a reduced inductance when compared to that of a conventional capacitor. this is a result of the novel internal electrode structure which inherently reduces the inductance by the cancellation effect of opposing currents in close proximity. the capacitance line to ground (common mode) is closely matched due to the symmetry within the design. as the device includes line to ground capacitance for both lines, any temperature, ageing and voltage effects will have an equal infuence on both lines therefore maintaining balanced decoupling. because the part acts as a de-coupling device, the current limitations of a standard 3 terminal chip do not apply. the single line 3 terminal feedthrough chip carries the signal current through the very thin feedthrough electrodes within the device which have limited dc resistance and so can cause excessive heating, hence the maximum permissible current is often limited to around 300ma for a 1206 device. the integrated passive component is in by-pass across two lines and so is unaffected by high signal currents. the table below offers a comparison of de-coupling devices and demonstrates how the integrated passive component extends the options for emc circuit protection. input 1 input 2 gr ound aa bb c1 c1 c2 signal return c1 c1 component advantages disadvantages applications chip capacitor industry standard requires 1 per line high inductance capacitance matching problems by-pass low frequency 3 terminal feedthrough feedthrough lower inductance current limited feedthrough unbalanced lines high frequency syfer x2y integrated passive component very low inductance replaces 2 (or 3) components negates the effects of temperature, voltage and ageing provides both common mode and differential mode attenuation can be used on balanced & unbalanced lines care must be taken to optimise circuit design by-pass balanced lines high frequency dc electric motors unbalanced lines audio amplifers canbus -10 0 -30 -20 -70 -40 -50 -60 0.1 11 0 100 1000 5000 680nf 400nf 220nf 100nf 47nf 10nf 1nf 470pf 100pf 27pf -10 0 -30 -20 -70 -40 -50 -60 11 0 100 1000 5000 100nf 10nf 47nf 1nf 470pf insertion loss (db) insertion loss (db) frequency (mhz) frequency (mhz) filtering application decoupling application surface mount emi flters - x2y integrated passive components fltsmx2y.ver7
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